Integrated heat dissipation and shielding cover - e-conn Technology

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High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space
Precision stretch one-piece molding process, with no splicing welds, high structural stability, and good consistency in mass production
The built-in heat dissipation bump structure significantly increases the contact area with components, resulting in a substantial improvement in heat dissipation efficiency
Standardized mounting hole design, compatible with SMT soldering/snap-fit assembly
Environmentally friendly and halogen-free material, compliant with the general environmental standards of the electronics industry

structureBuilt-in multiple sets of heat dissipation bumps, positioning mounting holes, and cooling vents

substrateHigh thermal conductivity aluminum alloy / stainless steel

appearanceSquare tensile structure

forming processPrecision stretch stamping and integrated molding

surface processNatural color passivation / tin plating treatment

contact resistance≤10mΩ

dimensional toleranceImplement the GB/T 13914 standard for stamped parts tolerances, with key installation dimensions at ±0.1mm

Environmental standardsHalogen-free material, compliant with RoHS

Shielding effectivenessThe shielding effectiveness in the frequency band of 30MHz~10GHz is ≥35dB

Heat dissipation performanceReduce the operating temperature of components by more than 15℃

Integrated heat dissipation and shielding cover

Name: Integrated heat dissipation and shielding cover
Brand: Automotive sensor

Model: YK569

consumer electronicscommunicationcar