Smart Manufacturing
High-density cooling solution for high-speed optical modules
High-speed networking equipment for data centers is primarily designed for high bandwidth, high concurrency, high density, and long-term stable operation. It meets stringent industry standards for port heat dissipation, signal integrity, and anti-interference performance.
Solution Details
Learn more about the core content of this solution
High-speed optical communication equipment in data centers has extremely stringent requirements for transmission bandwidth, concurrency, heat dissipation, and signal integrity. Conventional optical port cages have low density, poor heat dissipation, and weak anti-interference capabilities, making them unable to meet the all-weather stable transmission needs of 10G/25G and higher-speed data. There is an urgent need for a professional high-speed interface solution with high density, strong heat dissipation, and high shielding.
Customer requirements: The customer is developing high-speed switches and server optical port cards for data centers, focusing on 10G/25G high-speed transmission and high-density port expansion. Due to limited PCB space on the cards, a multi-port dense arrangement solution is needed to increase the number of ports and concurrent processing capabilities. High-speed SFP+ and QSFP-DD optical modules operate under high load for extended periods, generating significant heat from the chips. Conventional cages lack a heat dissipation structure, which can easily lead to issues such as speed reduction due to high temperatures, equipment downtime, and transmission stalls. Therefore, an efficient heat dissipation structure is required. Additionally, high-speed signal transmission demands stringent shielding to prevent signal crosstalk, electromagnetic interference, signal attenuation, and data packet loss between ports. It must strictly meet the demanding standards of 7x24-hour uninterrupted, high-precision, and high-speed transmission in data centers.
Core Solution: The solution is equipped with Yukun's full range of high-density SFP+ single/multi-row cages and QSFP-DD high-speed cages, supporting 1×2, 2×2, 2×4, 2×6 multi-specification dense arrangement. It maximizes the number of ports within the limited PCB card space, meeting the high-bandwidth and high-concurrency expansion needs of data centers. To address the heat generation issue of high-speed modules, exclusive supporting SFP12-5146-501A and SFP12-5146-500A models with heat sinks are provided. The metal heat conductors fit closely to the core heat-generating areas of the modules, quickly dissipating accumulated heat, effectively controlling operating temperature, and avoiding performance degradation and equipment downtime caused by high temperatures. The product adopts an integrated thickened shielded housing, coupled with a precise grounding structure, effectively isolating external electromagnetic interference, suppressing high-speed port crosstalk issues, and ensuring the integrity of ultra-high-speed signal transmission from 10G to QSFP-DD. The entire series has passed high-frequency signal, high and low temperature, and longevity aging tests, fully meeting the all-weather high-speed operation standards of data centers.
Advantages of the solution: The high-density arrangement design significantly enhances the port expansion capacity of the equipment, meeting the high-speed networking upgrade requirements of data centers. The exclusive cooling structure completely resolves the issues of speed reduction and downtime caused by high temperatures in high-speed modules, greatly improving the operational stability of the equipment. The high-standard shielding structure eliminates crosstalk and attenuation of high-speed signals, ensuring precise and efficient data transmission. The product boasts stringent quality and stable performance, suitable for high-end computing power and core equipment in data centers, helping customers build high-performance and highly reliable high-speed optical communication equipment.
This high-speed optical module's high-density cooling solution specifically addresses three core challenges in data centers: insufficient port density of high-speed equipment, module downtime due to high temperatures, and high-speed signal crosstalk leading to packet loss. Through high-density port arrangement, a dedicated cooling structure, and high-standard shielding design, it fully meets the 7×24-hour high-bandwidth, high-concurrency, and high-precision transmission requirements of data centers, providing reliable interface support for high-end optical communication and computing equipment.
