shield can
Model: YK583
Applications
Description
The YK583 shielding cover is an electromagnetic shielding component specifically designed for PCB precision circuits. It utilizes a 0.2mm thick C7701 semi-hard white copper substrate, which boasts excellent conductive shielding performance and solderability. Precisely stamped and integrally formed, the surface is thoroughly cleaned and degreased, leaving it burr-free and oil-free, suitable for SMT patch soldering processes. The product strictly adheres to the GB/T15055-m stamping tolerance standard, with critical dimensions undergoing CPK control. It can effectively block EMI electromagnetic interference and is widely used in scenarios such as automotive electronics, communication equipment, and RF modules, providing reliable electromagnetic shielding protection for precision circuits.
Features
- C7701 nickel silver substrate, with high conductivity, effectively blocks EMI electromagnetic interference
- The surface is clean and free of oil stains, suitable for SMT chip soldering process, ensuring firm and stable soldering
- The porous structure takes into account both shielding effect and heat dissipation efficiency, effectively reducing the operating temperature of circuit modules and enhancing equipment stability
- Adaptability - Operating in a temperature range of -40℃ to +85℃, the material is resistant to corrosion and oxidation, ensuring stable performance over long-term use
- Precision stamping and integrated molding, high structural strength, impact resistance, and wear resistance
- All materials comply with the requirements of GB/T 30512-2014 for prohibited substances in automobiles
- Adapted to standard PCB pad design, it can directly match the installation requirements of corresponding circuit modules, with strong compatibility
- The substrate exhibits excellent conductivity and low contact resistance, ensuring the stability of circuit signal transmission
Specifications
Whitepapers
Features
- C7701 nickel silver substrate, with high conductivity, effectively blocks EMI electromagnetic interference
- The surface is clean and free of oil stains, suitable for SMT chip soldering process, ensuring firm and stable soldering
- The porous structure takes into account both shielding effect and heat dissipation efficiency, effectively reducing the operating temperature of circuit modules and enhancing equipment stability
- Adaptability - Operating in a temperature range of -40℃ to +85℃, the material is resistant to corrosion and oxidation, ensuring stable performance over long-term use
- Precision stamping and integrated molding, high structural strength, impact resistance, and wear resistance
- All materials comply with the requirements of GB/T 30512-2014 for prohibited substances in automobiles
- Adapted to standard PCB pad design, it can directly match the installation requirements of corresponding circuit modules, with strong compatibility
- The substrate exhibits excellent conductivity and low contact resistance, ensuring the stability of circuit signal transmission
Specifications
shield can
Model: YK583
Applications
Description
The YK583 shielding cover is an electromagnetic shielding component specifically designed for PCB precision circuits. It utilizes a 0.2mm thick C7701 semi-hard white copper substrate, which boasts excellent conductive shielding performance and solderability. Precisely stamped and integrally formed, the surface is thoroughly cleaned and degreased, leaving it burr-free and oil-free, suitable for SMT patch soldering processes. The product strictly adheres to the GB/T15055-m stamping tolerance standard, with critical dimensions undergoing CPK control. It can effectively block EMI electromagnetic interference and is widely used in scenarios such as automotive electronics, communication equipment, and RF modules, providing reliable electromagnetic shielding protection for precision circuits.
Whitepapers
Related Cases
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