Integrated square heat dissipation and shielding cover
Model: YK587
Applications
Description
The YK587 heat sink is a precision stamped and formed square heat dissipation and shielding integrated component made of 1.0mm thick 1060 aluminum alloy, which combines excellent thermal conductivity and electromagnetic shielding efficiency. The product is preset with multiple sets of standardized mounting holes, suitable for PCB board soldering/screw fixation installation, which can quickly reduce the operating temperature of core components while isolating electromagnetic interference between circuits. It complies with RoHS environmental standards and comes with a test report for each batch. It is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, and other scenarios.
Features
- 1060 aluminum alloy substrate, with a standard thickness of 1.0mm, combines excellent thermal conductivity and structural strength, and is resistant to corrosion and deformation
- The graded tolerance control system focuses on CPK control for key dimensions, and unmarked dimensions are uniformly subject to the national standard m-level criteria
- Precision stamping and integrated molding process, without splicing welds, high structural stability, burr height ≤0.05mm
- Standardized mounting hole design, compatible with mainstream PCB board layouts, supports screw fixation / SMT soldering
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference
Specifications
Whitepapers
Features
- 1060 aluminum alloy substrate, with a standard thickness of 1.0mm, combines excellent thermal conductivity and structural strength, and is resistant to corrosion and deformation
- The graded tolerance control system focuses on CPK control for key dimensions, and unmarked dimensions are uniformly subject to the national standard m-level criteria
- Precision stamping and integrated molding process, without splicing welds, high structural stability, burr height ≤0.05mm
- Standardized mounting hole design, compatible with mainstream PCB board layouts, supports screw fixation / SMT soldering
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference
Specifications
Integrated square heat dissipation and shielding cover
Model: YK587
Applications
Description
The YK587 heat sink is a precision stamped and formed square heat dissipation and shielding integrated component made of 1.0mm thick 1060 aluminum alloy, which combines excellent thermal conductivity and electromagnetic shielding efficiency. The product is preset with multiple sets of standardized mounting holes, suitable for PCB board soldering/screw fixation installation, which can quickly reduce the operating temperature of core components while isolating electromagnetic interference between circuits. It complies with RoHS environmental standards and comes with a test report for each batch. It is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, and other scenarios.
Whitepapers
Related Cases
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