Heat dissipating cover
Model: YK625
Applications
Description
The YK625 heat sink is a precision-stretched, square-shaped heat dissipation component made of high thermal conductivity metal substrate. It integrates multiple sets of standardized mounting holes and irregular heat dissipation cavities, providing both efficient heat dissipation and electromagnetic interference isolation between circuits. The product is compatible with mainstream PCB board installation layouts and can be securely installed through soldering or screw fixation. It can quickly reduce the operating temperature of core components and simultaneously isolate electromagnetic interference between circuits. It meets environmental and electronic industry standards and is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, and other scenarios.
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
- The graded tolerance control system focuses on CPK control for key dimensions, and undeclared dimensions are uniformly subject to the national standard m-level criteria
- Precision stretch integrated molding process, no splicing welds, high structural stability, burr height ≤0.05mm
- The unique heat dissipation bump structure significantly increases the contact area with components, achieving high fit and significantly improving heat dissipation efficiency
- Standardized mounting hole design, compatible with mainstream PCB board layouts, supports screw fixation / SMT soldering
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space
Specifications
Whitepapers
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
- The graded tolerance control system focuses on CPK control for key dimensions, and undeclared dimensions are uniformly subject to the national standard m-level criteria
- Precision stretch integrated molding process, no splicing welds, high structural stability, burr height ≤0.05mm
- The unique heat dissipation bump structure significantly increases the contact area with components, achieving high fit and significantly improving heat dissipation efficiency
- Standardized mounting hole design, compatible with mainstream PCB board layouts, supports screw fixation / SMT soldering
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space
Specifications
Heat dissipating cover
Model: YK625
Applications
Description
The YK625 heat sink is a precision-stretched, square-shaped heat dissipation component made of high thermal conductivity metal substrate. It integrates multiple sets of standardized mounting holes and irregular heat dissipation cavities, providing both efficient heat dissipation and electromagnetic interference isolation between circuits. The product is compatible with mainstream PCB board installation layouts and can be securely installed through soldering or screw fixation. It can quickly reduce the operating temperature of core components and simultaneously isolate electromagnetic interference between circuits. It meets environmental and electronic industry standards and is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, and other scenarios.
Whitepapers
Related Cases
Vehicle-mounted shielding/cooling/radome | AI intelligent driving domain controller and radar module supporting project
The onboard domain controller and radar module of intelligent driving solution providers are prone to electromagnetic interference due to their internal circuits, poor chip heat dissipation, and inadequate antenna protection, leading to unstable AI perception data. Our company customizes integrated shielding covers, heat dissipation covers, and antenna covers that combine electromagnetic isolation, thermal conduction and dissipation, and antenna protection. These products have passed AEC-Q automotive testing, ensuring pure radar and domain controller signals and stable support for AI multi-sensor fusion operations. They are now available for bulk supply to designated customers.
某智能汽车企业
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某国家级高新技术企业