Features

• High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
• The graded tolerance control system focuses on CPK control for key dimensions, and undeclared dimensions are uniformly subject to the national standard m-level criteria
• Precision stretch integrated molding process, no splicing welds, high structural stability, burr height ≤0.05mm
• The unique heat dissipation bump structure significantly increases the contact area with components, achieving high fit and significantly improving heat dissipation efficiency
• Standardized mounting hole design, compatible with mainstream PCB board layouts, supports screw fixation / SMT soldering
• The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space

Specifications

Square heat dissipation and shielding integrated cover 1

Model: YK625

Applications