Radiator cover
Model: YK569
Applications
Description
The YK569 heat sink is a precision-stretched and molded integrated component for heat dissipation and electromagnetic shielding. Made of high thermal conductivity metal substrate, it integrates multiple sets of heat dissipation bumps, positioning mounting holes, and heat dissipation holes, providing dual functions of efficient heat dissipation and electromagnetic shielding. The product can be securely mounted on a PCB board through welding or snap-fitting, quickly reducing the operating temperature of core components while isolating electromagnetic interference between circuits. It meets environmental and industry-wide standards and is widely used in component heat dissipation and electromagnetic protection in scenarios such as communication equipment, industrial control motherboards, and consumer electronics.
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space
- Precision stretch one-piece molding process, with no splicing welds, high structural stability, and good consistency in mass production
- The built-in heat dissipation bump structure significantly increases the contact area with components, resulting in a substantial improvement in heat dissipation efficiency
- Standardized mounting hole design, compatible with SMT soldering/snap-fit assembly
- Environmentally friendly and halogen-free material, compliant with the general environmental standards of the electronics industry
Specifications
Whitepapers
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity with structural strength, corrosion resistance, and resistance to deformation
- The integrated design of heat dissipation and shielding simultaneously addresses two core requirements: component heat dissipation and electromagnetic interference, while saving PCB layout space
- Precision stretch one-piece molding process, with no splicing welds, high structural stability, and good consistency in mass production
- The built-in heat dissipation bump structure significantly increases the contact area with components, resulting in a substantial improvement in heat dissipation efficiency
- Standardized mounting hole design, compatible with SMT soldering/snap-fit assembly
- Environmentally friendly and halogen-free material, compliant with the general environmental standards of the electronics industry
Specifications
Radiator cover
Model: YK569
Applications
Description
The YK569 heat sink is a precision-stretched and molded integrated component for heat dissipation and electromagnetic shielding. Made of high thermal conductivity metal substrate, it integrates multiple sets of heat dissipation bumps, positioning mounting holes, and heat dissipation holes, providing dual functions of efficient heat dissipation and electromagnetic shielding. The product can be securely mounted on a PCB board through welding or snap-fitting, quickly reducing the operating temperature of core components while isolating electromagnetic interference between circuits. It meets environmental and industry-wide standards and is widely used in component heat dissipation and electromagnetic protection in scenarios such as communication equipment, industrial control motherboards, and consumer electronics.
Whitepapers
Related Cases
Vehicle-mounted shielding/cooling/radome | AI intelligent driving domain controller and radar module supporting project
The onboard domain controller and radar module of intelligent driving solution providers are prone to electromagnetic interference due to their internal circuits, poor chip heat dissipation, and inadequate antenna protection, leading to unstable AI perception data. Our company customizes integrated shielding covers, heat dissipation covers, and antenna covers that combine electromagnetic isolation, thermal conduction and dissipation, and antenna protection. These products have passed AEC-Q automotive testing, ensuring pure radar and domain controller signals and stable support for AI multi-sensor fusion operations. They are now available for bulk supply to designated customers.
某智能汽车企业
AI Smart Network Gateway | High-Speed Communication Supporting Project for Edge AI Computing Gateway
The cooperating enterprise of this project is a national high-tech enterprise, specializing in the research, development, and manufacturing of industrial Internet and edge AI computing equipment, with a focus on AI intelligent gateways and industrial edge computing terminal devices. The equipment is required to perform high-speed acquisition of visual data and sensor data from the production line, and local AI inference, 24/7. The customer's original equipment suffers from issues such as network port packet loss, electromagnetic crosstalk, chip heat accumulation, and antenna signal attenuation. Our company provides a comprehensive solution of RJ45/SFP/USB connectors + shielding/heat dissipation/antenna covers, ensuring high-speed, stable, and long-lasting operation of AI network-connected devices
某国家级高新技术企业