Features

• PBT plastic, insulation, high temperature resistance, small injection shrinkage, suitable for fixing and supporting electronic components.
• The chamfering control is set at 0.25~0.5mm; for chamfers without special requirements, R0.2-0.5mm ≤ C0.3 MAX; there must be no sharp edges; the mold slope is 1°2'
• The components and packaging units are free of grease and foreign particles
• The engraved content on the inside of the product includes: hexagon, material, and date stamp; the engraved characters should not protrude above the plane
• One-piece injection molding, with a special-shaped hollow structure for weight reduction, and multi-level positioning pillars for layered spacing control.
• Multiple sets of through-holes combined with positioning posts achieve dual-layer positioning, suitable for PCB/connector assembly and fixation.
• Focus on controlling key dimensional markings, and simultaneously perform CPK dimensional stability verification to ensure high consistency in mass production.
• Deburr and chamfer edges and corners; ensure the product is free from contamination; the surface must be free of cracks, shrinkage, and any penetrating defects

Specifications

Absorbing sheet

Model: CA02-2010-1000

Applications

Description