Heat dissipator cover
Model: YK576
Applications
Description
The YK576 heat sink utilizes a high thermal conductivity metal substrate, integrating installation positioning holes, a special-shaped heat dissipation chamber, and a fixed structure. It combines the dual functions of efficient heat dissipation and electromagnetic shielding. The product is compatible with long strip PCB component layouts and can be securely installed through soldering/screw fixation. It can quickly reduce the operating temperature of linearly arranged components while isolating electromagnetic interference between circuits. It meets environmental and industry-wide standards and is widely used in industrial control equipment, communication motherboards, automotive electronics, and other scenarios.
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity and structural strength, corrosion resistance, and resistance to deformation
- The long strip integrated design perfectly meets the heat dissipation needs of components arranged linearly, while achieving electromagnetic shielding for the entire circuit
- Precision stretch one-piece molding process, with no splicing welds, high structural stability, and good consistency in dimensions for mass production
- The unique heat dissipation cavity structure significantly increases the contact area with components, resulting in a notable improvement in heat dissipation efficiency
- Multi-point mounting hole design, compatible with both screws and welding, ensures stable installation and is suitable for automated mass production
Specifications
Whitepapers
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity and structural strength, corrosion resistance, and resistance to deformation
- The long strip integrated design perfectly meets the heat dissipation needs of components arranged linearly, while achieving electromagnetic shielding for the entire circuit
- Precision stretch one-piece molding process, with no splicing welds, high structural stability, and good consistency in dimensions for mass production
- The unique heat dissipation cavity structure significantly increases the contact area with components, resulting in a notable improvement in heat dissipation efficiency
- Multi-point mounting hole design, compatible with both screws and welding, ensures stable installation and is suitable for automated mass production
Specifications
Related Cases
Vehicle-mounted shielding/cooling/radome | AI intelligent driving domain controller and radar module supporting project
The onboard domain controller and radar module of intelligent driving solution providers are prone to electromagnetic interference due to their internal circuits, poor chip heat dissipation, and inadequate antenna protection, leading to unstable AI perception data. Our company customizes integrated shielding covers, heat dissipation covers, and antenna covers that combine electromagnetic isolation, thermal conduction and dissipation, and antenna protection. These products have passed AEC-Q automotive testing, ensuring pure radar and domain controller signals and stable support for AI multi-sensor fusion operations. They are now available for bulk supply to designated customers.
某智能汽车企业
